Electronic yarn is a kind of spun yarn. Its diameter is about 4-9μm. Electronic yarn has finer diameter and better performance, so that it can be used in the electronics and other high-end areas. while it have higher requirements for [...]
CCL-----Also known as the base material. CCL (Copper Clad Laminate) consists of wood pulp paper or glass fiber cloth as reinforcing materials with resin, and single or double-sided coated with copper foil, and laminated under high temperature and high pressure. [...]
Teflon high temperature cloth belt, Teflon high temperature mesh belt and Teflon tape are three extremely familiar words. In this bleak August, every order is really difficult. I always hold an inner gratitude for the customers who believe in me. [...]
1. Industrial production of epoxy resin in the world The first industrially valuable Bisphenol A epoxy resin of the world was manufactured in 1947 by Devoe-Raynolds of the United States. It opened up the technical history of chlorine-bisphenol A resin, [...]
FR-4 is the largest amount of CCL, The most widely used product,Its quality not only affects the CCL plant itself, but also seriously affect the processing rate of PCB processing and assembly of electronic products after the pass rate.Therefore, to [...]
Circuit board plate blister is actually a bad board adhesion problem, and then extended is the surface quality of the board, which contains two aspects: Board cleanliness problem; Surface roughness (or surface energy) problem. All boards on the board surface [...]
Definition and classification of CCL CCL definition—also known as substrate The reinforcing material is impregnated with resin, coated with copper foil on one or both sides, and a plate-like material made by hot pressing is called copper clad laminate (CCL). [...]
In the continuous development of information technology, electronic products, functions, types, structures are increasingly complex, to promote the PCB design gradually multi-level and high density, PCB design of the electromagnetic compatibility issues have also been valued and attention.Electromagnetic compatibility (EMC) [...]
The mounting form of the electronic components on the PCB has been developed from pin insertion using through-holes to high-density surface mount technology, and bare chip mounting is evolving from wire-to-die mounting. As from the QFP to BGA, CSP as [...]