FR4 epoxy resin insulation board is an ideal substrate material for manufacturing copper clad panels. It has excellent mechanical strength and electrical insulation properties. It can be used to manufacture high-performance electronic equipment, especially in the fields of automotive, aerospace, communications, and consumer electronics.
FR4 epoxy resin insulation board is composed of an epoxy resin impregnated glass fiber layer, and FR4 is its fire protection standard. Generally, FR4 boards have yellow, green, and transparent colors, with a thickness ranging from 0.1mm to 10cm. Copper clad plates are mainly used for printed circuit boards (PCBs), integrated circuits, and electrical connections. They are usually made by pressing copper foil and FR4 insulating plates, and FR4 shifts play a role in supporting, insulating, fireproof, and high-temperature resistance.
Compared with other materials, FR4 sheets have many advantages. Firstly, it has a glass transfer temperature (Tg) of about 140 ℃. This means that it can withstand high temperatures without losing its mechanical or electrical properties. This is very important in electronic applications, such as in automobiles or avionics. Secondly, FR4 epoxy resin insulation board has excellent chemical resistance. It can withstand a wide range of chemicals, including acids, bases, and solvents. This makes it an ideal choice for use in harsh environments, such as industrial equipment. In addition, the FR4 epoxy resin insulation board also has high mechanical strength, which can withstand high pressure and resist bending. This makes it an ideal material for manufacturing high-density circuit boards.
To understand the application of FR4 insulation board in copper clad foil in detail, you need to understand how circuit board PCBs are manufactured.
Generally, there are three steps: pretreatment, film application, and pressing.
First, clean and treat the glass fiber cloth to remove any impurities and surface defects that may have a negative impact on the manufacturing process. Then, the epoxy resin is coated on the glass fiber cloth to form an epoxy resin layer. Next, multilayer glass fiber cloth and epoxy resin layers are stacked together, and they are pressed into a plate using a high-temperature and high-pressure process.
Here we have the FR4 plate.
Next, apply the copper foil to one side of the FR4 epoxy insulation board. This can be done by mechanical or chemical methods. In mechanical methods, copper foil is bonded to FR4 plates by rolling or rolling. In the chemical method, copper foil is chemically deposited onto the surface of the FR4 plate using a chemical method.
Here we have a copper clad plate, which is made of FR4 plate as the inner core.
Finally, a chemical etching technique is used to peel off the uncovered copper foil to form the desired circuit pattern. This process is called “etching” and can be accomplished by chemical or mechanical means.
By this point, the manufacturing of the circuit board has been completed.
We are a factory that produces and sells insulating boards. Our factory is located in China, and our products are mainly used for export. If you need FR4 insulating boards, please contact us. Our factory supports OEM and ODM services. At the same time, we can provide free sample services for various FR4 specifications. Note that the sample size is limited to A4 size.