FOREWORD
The purpose of this test methods manual is to contain, in one document, pertinent information on test methods that will be useful to manufacturers and users of printed boards, electronic assemblies, hybrid circuits, discrete wiring, and flflat cable. It provides an organized reference source for test methods, which can be utilized by the testing laboratories of manufacturers and users of products of the electronic interconnection industry. In addition, this document provides an organized reference source of test methods that can be utilized by the technical committees of the IPC, in their work to develop new standards and specififications.
TELLS HOW TO TEST — NOT REQUIREMENTS FOR ACCEPTANCE
This test methods manual is designed to provide specifific information on test methods. It does not attempt to establish acceptability levels for performance. Details of performance requirements can be found in appropriate IPC specifificaꢀtions, which are referenced in the manual.
ABOUT THE TEST METHODS IN THIS MANUAL
Each test method includes a brief description of its purpose and provides a listing of all equipment, apparatus, and other required materials necessary to perform the specifified procedures. The test method may also include brief menꢀtion of limitations and/or specifific areas of non-applicability. Procedures for performing each test method are detailed in this publication. They include information on specifific conꢀditioning, curing, or other specimen preparation, as well as the specifific procedure for conducting the test. Each proꢀcedure is sufficiently detailed so that the test can be accomplished by a technician familiar with standard laboratory practices and procedures.
SOURCE OF TEST METHODS IN THIS MANUAL
Most of the test methods published in this manual have been taken from previously approved standards and specififi- cations of the IPC. Therefore, these test methods have been reviewed and approved by the entire membership of the IPC. Since the IPC membership represents both manufacturers and users, and since they represent technical represenꢀtatives from supplier member companies and technical experts from many government agencies, the standards and specififications approved by the IPC have a broad base of acceptance. In the event of a dispute over details of an IPC test method, the details of the test method published in the individual IPC standards and specififications should be considered the governing document. Other test methods included in this manual have been taken from government standards or other standards that have extensive use in the electronic interconnection industry.
FUTURE TEST METHODS
The IPC will continue its efforts to maintain an awareness of all new developments in test methods. As new requireꢀments for testing are developed, they will be studied by the IPC Test Methods Subcommittee and by other appropriꢀate technical committees of the IPC. Where appropriate, such test methods will be approved and formatted for incluꢀsion in the IPC-TM-650. With regard to new test methods, the IPC seeks ideas and recommendations from all who are concerned with printed board and related interconnection products. If you have ideas for new tests that are needed, or information on new tests that are available for use in our industry, contact the IPC at 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015, Tel 847/615/7100, Fax 847/615/7105.
