Along with the electronic products to the light, thin, small, high density, and more functional development, density of components on printed circuit board assembly and integration is higher and higher, power consumption is more and more big, and the heat dissipation of PCB substrate requirement has become more and more urgent.If the heat dissipation of substrate is not good, it will lead to overheated components on printed circuit board, which decreased the machine reliability.Under the background, the high heat metal PCB substrate was born.
The most widely used in the PCB substrate metal is Aluminum copper clad, which was invented by Japanese SANYO national policy in 1969. In 1974, It was applied to the series STK power amplifier hybrid integrated circuit.Base copper clad metal is mainly used in military products in China in the early 80s. However, the material of PCB substrate metal was entirely dependent on imports, although expensive.In mid and late 80s, with the aluminum copper clad was widely used and dosage in automobile, motorcycle electronics, it promoted the PCB substrate metal research in China and the development of manufacturing technology and its application in electronics, telecommunications, power, and many other areas of a wide range of applications.
Foreign representative metal substrate with Japan’s sumitomo, Japan panasonic electrician, DENKA HITY PLATE company, The berg in the United States, etc. Japan’s sumitomo metal PCB substrate has three big series (that is, Aluminium-based CCL,Iron-based CCL,Silicon steel CCL).The product brands of Aluminium based CCL, Iron based CCL, Silicon steel CCL respectively are ALC – 1401 and ALC – 1370 , ALC – 5950 and ALC – 3370 and ALC – 2420 .The earliest research base CCL metal production factory in China is state-owned 704 factory.Many domestic units in the late 90s had developed and producted aluminium based CCL 704 factory of metal substrate has three series, namely the aluminum based CCL, the based CCL, the iron based CCL.704 factory according to the characteristic difference of aluminium base copper clad laminates can be divided into general and high heat dissipation and high frequency circuit with three kinds of models, and their commercial grades respectively are MAF respectively – 01, MAF – 02, MAF – 03.But the copper base plate and the iron base board commodity grades respectively are LSC – 043 – f and MSF – 043.It is estimated that the global metal base PCB production value is about $2 billion. In 1991, Japanese metal base PCB production value was 2.5 billion yen, it was 6 billion yen in 1996, and increased to 8 billion yen in 2001, about increasing at an annual rate of 13%.
The introduction of copper clad laminates.
The main material of printed circuit board (PCB) is copper clad, and copper clad (coated copper) is composed of substrate, copper foil and adhesive. Substrate is an insulation board that composed by high polymer synthetic resin and reinforced material insulation board; the surface of the substrate is covered with a layer of high conductivity, good weldability of pure copper foil and the thickness of the commonly used 35 ~ 50 / ma; Copper foil covering the substrate side of the CCL called single CCL, both sides of the CCL called double-sided CCL; Copper foil can be firmly on the substrate depending on adhesive.Commonly used the thickness of the copper clad is 1.0 mm, 1.5mm and 2.0mm.
The kinds of the CCL are also more.According to the difference of the insulating materials, it can be divided into paper base board, glass cloth substrate and synthetic fiberboard; According to the difference of adhesive, it is divided into phenolic resin, epoxy resin, polyester and ptfe, etc.According to the difference of the application, it also can be divided into general type and special type.
The structure and characteristics of common CCL
Copper-clad Phenolic paper laminates: it is a laminated products that composed of impregnated paper (TFz-62) or cotton fiber impregnated paper (1TZ-63) coated with phenolic resin by hot pressing , both on the surface of tape can be attached to a single non-alkali glass impregnated fabric, one side of which is coated with copper foil.Mainly used as the printed circuit board
in radio equipment.
Copper-clad phenolic glass cloth: is dipped in epoxy phenolic resin with non-alkali glass cloth by hot pressing into laminated products, its one side or double side coated with copper foil, and it has advantages of quality light, good electrical and mechanical properties, easy processing, etc.The board face is light yellow, if using three cyanide diamine as curing agent, the board face is light green, with good transparency.Mainly used as printed circuit board in the radio equipment of high working temperature and high working frequency.
Copper-clad ptfe laminates: is used ptfe plate as substrate, and is coated copper foil by hot pressing into a coated copper.Mainly used as PCB in the hf and uhf lines.
Copper-clad epoxy glass cloth laminated sheet: it is a common materials of hole metallization PCB.
Soft polyester coated copper film: it is strip material that made of polyester film and copper hot pressing.In the application, it curled up into a spiral shape in internal equipment.In order to consolidate or moisture, it is often poured epoxy resin into and make it as a whole.Mainly used for flexible printed circuit and print cable, which can be used as the transition line of connector.
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