Detection and Measurement of Ionizable Surface Con

1 Scope 1.1 Purpose These tests are used as process control tools; they can be used to inspect printedboards or printed board assemblies and determine if they conform to the moniꢀtoring level of the user’s performance specification. Bulk ionic cleanliness testing may be accomplished by measuring the ionizable surface contaminants extracted by the following three methods: 1. Manual extraction method 2. Dynamic extraction method 3. Static extraction method Note: Please note that this method does not predict reliabilꢀity and should only be used as a process control tool. 1.2 Restrictions Measurements of ionic conductivities do not differentiate between different ionic species. They simply measure conductivities (or resistivities) which can be related to amounts of ionic materials present in solution. There is no identification of the contribution to the total conductivity readꢀings of any individual ionic species which may be extracted into the solution. For measurement of individual ionic species (type [...]

2021-08-25T04:00:38+00:00August 24, 2021|


FOREWORD The purpose of this test methods manual is to contain, in one document, pertinent information on test methods that will be useful to manufacturers and users of printed boards, electronic assemblies, hybrid circuits, discrete wiring, and flflat cable. It provides an organized reference source for test methods, which can be utilized by the testing laboratories of manufacturers and users of products of the electronic interconnection industry. In addition, this document provides an organized reference source of test methods that can be utilized by the technical committees of the IPC, in their work to develop new standards and specififications. TELLS HOW TO TEST — NOT REQUIREMENTS FOR ACCEPTANCE This test methods manual is designed to provide specifific information on test methods. It does not attempt to establish acceptability levels for performance. Details of performance requirements can be found in appropriate IPC specifificaꢀtions, which are referenced in the manual. ABOUT THE [...]

2021-08-25T04:07:53+00:00August 24, 2021|

Porosity Testing of Gold Electrodeposited on a Nic

Substrate Electrographic Method 1 Scope This test method provides a procedure for testing the porosity of gold electroplated from an alkaline (cyanide), acid, or neutral gold plating solution on a nickel substrate in contact with the gold deposit. 2 Applicable Documents :None 3 Materials and Equipment 3.1 Materials :Acetone, Sodium Nitrate, Reagent GD. (NaNO3), Sodium Carbonate, Anhydrous, Reagent GD. (Na2CO3), Dimethylglyoxime, Denatured Ethyl Alcohol No. 3A, Reagent GD. (C2H5OH), hotographic Paper with Silver Halide removed. (Kodabromide, glossy finish, single wt. phoꢀtographic paper (fixed before use), Ammonium Hydroxide, Reagent GD. (NH4OH) 3.2 Equipment 3.2.1 DC power supply to 0 amp to 1 amp. DC minimum, 0 volts to 10 volts 3.2.2 DC Milliammeter, 0 mA to 100 mA 3.2.3 Electrographic Clamp-Press 4 Equipment/Apparatus :None 5 Procedure 5.1 Solution Make Up 5.1.1 Electrolyte :Concentration: NaNO3 1% (wt.) Na2CO3, Anhydr. 4% (wt.) Distilled water – balance by wt. Preparation of 500 g (Vol. [...]

2021-08-25T04:13:42+00:00August 24, 2021|

Capacitance of Insulting Materials

1 Scope The purpose of this test is to measure the capacitance effects arising from plastic substrates, adhesives, or coatings, which may be critical to the reliable functioning of a circuit. 2 Applicable Documents None 3 Test Specimen Specimen thickness for all tests must be uniform within ±1% of the average thickness. At frequencies below 1 MHz the specimen shall be large enough to provide circular electrodes at least 10 cm in diameter and between 1.5 mm to 6.35 mm thick. At frequencies from 1.0 MHz to 1000 MHz, a micrometer electrode holder should be used with the test specimen. 4 Equipment/Apparatus 4.1 A bridge or resonant circuit capable of measuring the capacitance and dissipation factor with the required accuracy at the specified frequency may be used. The inherent accuracy of the measurement shall be ± 0.5%, ± 0.2% picofarad, unless otherwise specified. The electrode material may be thin foil, [...]

2021-08-25T07:59:31+00:00August 24, 2021|

Arc Resistance of Printed Wiring Material

1.0 Scope This method describes a technique for evaluating a material to resist tracking when subjected to a low current arc just above the surface of the material. It can be used on materials of various thickness by stacking materials. This procedure is based on techniques described in ASTM D495. 2.0 Applicable Documents ASTM D495 Standard Test Method for High Voltage, LowCurrent, Dry Arc Resistance of Solid Electrical Insulation Manufacturer’s Instruction Manual. 3.0 Test Specimens 3.1 Number Three specimens shall be used unless otherꢀwise specified. 3.2 Form Each specimen shall be 3.0 in. x 2.0 in. Material under 0.06 in. in thickness shall be built up to provide a specimen at least 0.06 in. but not exceeding 0.125 in. For very thin laminates a 1/16 in. laminate of the same type may be used under the actual specimen subjected to the arc, permitting a reduction of the material required without [...]

2021-08-25T02:08:18+00:00August 24, 2021|

The Technology FR-4 Sheet

Affected by the Covid-19 in the past year, many companies have stopped work and production, the market growth of the electronics industry and the composite material industry has declined. However, the global market demand for FR4 epoxy insulating sheet and FR4 copper clad laminate has been increasing. In the composite material industry, more and more companies are using FR4 epoxy insulation sheet to replace old materials. Among the copper clad laminates widely used in the electronics industry, the copper clad laminate of FR-4 material has always maintained its dominant position. Excellent flame retardancy, insulation, and halogen-free environmental protection and safety in line with global certification. Under the sluggish global market, various factories are streamlining costs, but FR4 materials are at very good prices. These conditions have stimulated the market's increasing demand for FR4 materials. Here we share the two most common FR4 material process technologies based on our factory’s previous [...]

2021-03-19T03:02:40+00:00March 19, 2021|

The grade classification of FR-4 Copper Clad Laminate

Glass fiber epoxy copper clad laminate is referred to as FR-4 copper clad laminate. According to the quality requirements of the application, it can be divided into the following grades: FR-4 A1 copper clad laminate This grade of copper clad laminates are mainly used in military industry, communications, computers, digital circuits, industrial instrumentation, automotive circuits and other electronic products. This grade of copper clad laminates are widely used, and all technical performance indicators meet the needs of the above-mentioned electronic products. The quality of this grade product has reached the world-class level. FR-4 A2 copper clad laminate This grade of copper clad laminates are mainly used for ordinary computers, advanced home appliances and general electronic products. This grade series of copper clad laminates are widely used, and each performance index can meet the needs of general industrial electronic products. It has good price-performance ratio, which enables customers to effectively improve [...]

2021-10-25T10:04:25+00:00February 4, 2021|

How to solve the problem of warping in FR4 sheet and copper clad laminate production

When factories produce insulating boards and copper clad laminates, various production abnormalities are often found. These conditions will affect the progress of production and the yield of products. The most common problem is the warping of FR4 sheet and copper clad laminates produced. Sheet warping is the most common production quality problem, and it is also a problem that many manufacturers cannot fundamentally solve. As a factory specializing in production and research and development, we often encounter warping of the produced plates. For this reason, our engineers have given the following solutions based on past processing experience. Start with resin formulation The use of resins and curing agents with relatively long molecular chains and good flexibility is an important means to overcome the warping of the substrate. Modified phenolic resin can be considered for the board, which can effectively solve the warping problem of FR4 sheet and copper clad laminate [...]

2020-12-28T04:03:25+00:00December 28, 2020|

Environmentally friendly halogen-free and lead-free FR4 insulation laminates and copper clad laminates

Human development is always closely related to the environment. In the electronics industry, halogen-free laminates and lead-free processes are the two core concerns. The development of halogen-free laminates was in the mid-1980s, and the real industrialization was around 1997. The drafting of relevant standards was first issued and implemented by JPCA. As early as November 1998, Toshiba Chemical of Japan provided the world's first notebook computer with halogen-free laminates to the market. Flame retardant mechanism In the production system, gas phase flame retardant and condensed phase flame retardant are two widely recognized flame retardant modes for a long time. Phosphorus substances have the functions of dehydration, cross-linking, and carbon formation in the condensed phase during combustion, which can increase the carbon formation rate, which means that less materials are burned. Generally speaking, when the carbon formation rate is as high as 40-50%, The LOI can be higher than 30%. The [...]

2020-10-22T06:59:01+00:00October 22, 2020|

Various Exceptions And Solutions Of FR4

FR4 epoxy insulating board is a new type of review material made of glass fiber cloth and resin. The fusion of the two materials during the processing and production process will cause some abnormalities. The production department must deal with various abnormalities in time. To ensure the excellent quality of the product, we have sorted out the following situations of abnormal quality of FR4 sheets and corresponding solutions. DRY(Dried Laminate) Analysis of the cause: DRY is a very headache problem, and there are differences in degree. The severe case is general dryness, and the mild case occurs in the corners. The cause may be the poor compatibility of the Coupling Agent of the glass cloth and the resin. Poor adhesion. In addition, it may be that the film is overcure so that the resin fluidity is not good during pressing. If the resin flow of the film is found to [...]

2020-09-03T03:07:41+00:00September 3, 2020|
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