FR4 epoxy board processing method
There are many other names, including FR-4 light sheet, FR-4 fiber sheet, FR-4 epoxy sheet, FR-4 flame retardant sheet, so many names also reflect the wide application of FR-4 fiberglass sheet from other side. . FR-4 fiberglass sheet is generally used for [...]
The Supply Chain Status of one Important Raw Materials in Copper Clad Laminate (CCL) —-Electronic Fiberglass Yarn and Cloth
Electronic yarn is a kind of spun yarn. Its diameter is about 4-9μm. Electronic yarn has finer diameter and better performance, so that it can be used in the electronics and other high-end areas. while it have higher requirements for [...]
Basic knowledge of CCL
CCL-----Also known as the base material. CCL (Copper Clad Laminate) consists of wood pulp paper or glass fiber cloth as reinforcing materials with resin, and single or double-sided coated with copper foil, and laminated under high temperature and high pressure. [...]
The bleak August will be over, will there be rich in September?
Teflon high temperature cloth belt, Teflon high temperature mesh belt and Teflon tape are three extremely familiar words. In this bleak August, every order is really difficult. I always hold an inner gratitude for the customers who believe in me. [...]
Review the industrial production process of epoxy resin/epoxy fiberglass board for 60 years
1. Industrial production of epoxy resin in the world The first industrially valuable Bisphenol A epoxy resin of the world was manufactured in 1947 by Devoe-Raynolds of the United States. It opened up the technical history of chlorine-bisphenol A resin, [...]
Kinds layers and application areas for PC board
Paper Phenolic Resin Single,Double-sided board(FR1 & FR2) TV, monitor, power supply, stereo, copier, VCR, calculator, telephone, game devices, keyboard, epoxy composite substrate single & double board. CEM1 & CEM3 TV,monitor,power supply,advanced audio,telephone,game devices,automotive electronic products,mouse, electronic notepad. Fiberglass Cloth Epoxy [...]
Discussion on the features of No-Flow prepreg
In recent years, with the electronic products’fast developments to small, high-performance and multi-functionalization, multi-layer rigid-flex board, step board, cooling plate’s processing technology is rising. In order to prevent flowing glue in the rigid-flex joint、the step slot,etc., pure prepreg often be [...]
Features Brief of Non-Flow Prepreg
"No-flow" is the largest characteristic of the Non-Flow prepreg. This kind of plate has strict requirements to the flow ability of Non-Flow prepreg, to prevent flowing glue in the rigid-flex joint, the step slot, etc..From the melt viscosity curve of [...]
Non Flow Prepreg’s pressing method
From the R & D principle, the Non-Flow prepreg is epoxy system modified, by adding a low-flow polymer in the formula, through B-order chemical reaction to reduce the fluidity of the product itself. The early as rigid-flex board and step [...]