From the R & D principle, the Non-Flow prepreg is epoxy system modified, by adding a low-flow polymer in the formula, through B-order chemical reaction to reduce the fluidity of the product itself. The early as rigid-flex board and step board\u2019s connecting material -pure prepreg, mainly is the acrylic system materials. As the two materials\u2019reaction system is not same, Non-Flow Prepreg\u2019s pressing way can not simply apply pure prepreg\u2019s fast-pressing way, otherwise easily lead to board layer blast because of material curing is insufficient.<\/p>\n
Fast-Pressing Method
\nThe comparison of the experimental results with SP120N was carried out using fast pressing (Table 2) and fast heating pressing bonding (Fig. 9). The board structure was 3 \u00d7 1080 (RC = 64%) + CCL substrate (e.g.S1000-2).
\n![\"20160701\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/20160701.jpg\")
\nTale 2 Pressing Way
\n![\"2016120702\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120702.jpg\")
\nNote: Heat-up rate:3.0-5.0\u2103\/min(70-130\u2103)
\nCure time: >30min(170-180\u2103)
\nNote: Heat-up rate:3.0-5.0\u2103\/min(70-130\u2103)<\/p>\n
The heat resistance of the materials was measured under the two kinds of pressing methods.The results are shown in Table 3. Fig. 10 and Fig.11.
\n![\"2016120703\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120703.jpg\")
\nTable 3 The Heat Resistance Test Result
\n![\"2016120704\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120704.jpg\")
\nFig.10 SP120N Substrate OK<\/p>\n
![\"2016120705\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120705.jpg\")
\nFig.11 SP120N Substrate layer bubbling<\/p>\n
From the above experimental results, SP120N Non-Flow Prepreg\u2019s compression method can not simply apply pure prepreg\u2019s fast-pressing method, otherwise easily lead to heat resistance became deteriorated because of material curing is insufficient.<\/p>\n
Special Pressing Method
\nAccording to the flow curve of the resin melt viscosity for Non-Flow Prepreg and the ordinary FR4 prepreg,we can see the melt viscosity of the Non-Flow prepreg is higher than that of the ordinary FR-4, and the lowest melt viscosity is 10 to 100 times higher than that of the ordinary FR-4, and the melt viscosity of the Non-Flow Prepreg is higher than that of the conventional FR-4.In order to better wetting and bonding, must provide high pressure, otherwise easily to cause cavity of Non-Flow prepreg.
\nThe contrast experiment of the different compression procedure was carried out with SP120N.The structure of the board was as follows: 3 \u00d7 1080 (RC = 64%) + CCL Substrate (e.g.S1000-2).
\nThe parameters of the lamination program are shown in Table 4.
\n![\"2016120706\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120706.jpg\")
\nTable 4 Heating rate verification test
\nThe heat resistance of the material under both pressing procedures was tested. The results are shown in Table 5.
\n![\"2016120707\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120707.jpg\")
\nTable 5 The Heat Resistance Test Result
\nFrom the above experimental results, because SP120N Non-Flow Prepreg has low fluidity, the method is different from the ordinary FR-4 material, and can not simply apply the ordinary FR-4 material compression method, otherwise easily lead to heat resistance became deteriorated because Non-Flow prepreg and bonding interface\u2019s cavity.<\/p>\n
More products informations, please contact system@corefrp.com, we have a specialized technical engineers service for you, at the same time we can offer you free samples.<\/p>\n
![\"pdf\"](\"https:\/\/fr4material.com\/post\/pdf.png\")
Discussion on the features of No-Flow prepreg.pdf<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"