\nThe report pointed out that the demand of rigid-flex plate,step PCB board will increase year by year, as shown in Fig. 1.
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![\"2016120201\"](\"https:\/\/fr4material.com\/wp-content\/uploads\/2016\/12\/2016120201.png\")
\nFig 1 Demand change of rigid-flexible plate,step PCB board<\/p>\n
In recent years, with the electronic products\u2019fast developments to small, high-performance and multi-functionalization, multi-layer rigid-flex board, step board, cooling plate\u2019s processing technology is rising. In order to prevent flowing glue in the rigid-flex joint\u3001the step slot,etc., pure prepreg often be as a connecting materials,it is difficult to meet the requirement of the rigid-flex joint plate because of pure prepreg\u2019s poor stability. As a result, many PCB manufacturers are looking for other alternative materials for bonding between rigid boards and flexible boards, and the currently preferred replacement material is a Non-Flow Prepreg.
\nIt has bigger difference for Non-Flow Prepreg and ordinary FR-4,so we can not simply apply conventional FR-4\u2019s processing experience. For example, since the Non-Flow prepregs often require opening windows operations, the Non-Flow prepregs must have good toughness and machinability. “Non-Flow” is the largest characteristics of Non-Flow prepreg,if using the ordinary FR-4 lamination conditions when laminate Non-Flow prepregs, because of small glue flow,it will appear white spots and other defects in the line spacing of the board or the surface filling capacity.
\nThis paper combined with experimental verification,it is detailed analysis of the characteristics of Non-Flow prepreg,and provides numbers of recommendations for Non-Flow prepreg processing.<\/p>\n
![\"pdf\"](\"https:\/\/fr4material.com\/post\/pdf.png\")
Discussion on the features of No-Flow prepreg.pdf<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"