Affected by the Covid-19 in the past year, many companies have stopped work and production, the market growth of the electronics industry and the composite material industry has declined. However, the global market demand for FR4 epoxy insulating sheet and FR4 copper clad laminate has been increasing. In the composite… Continue Reading The Technology FR-4 Sheet
When factories produce insulating boards and copper clad laminates, various production abnormalities are often found. These conditions will affect the progress of production and the yield of products. The most common problem is the warping of FR4 sheet and copper clad laminates produced. Sheet warping is the most common production… Continue Reading How to solve the problem of warping in FR4 sheet and copper clad laminate production
FR4 epoxy insulating board is a new type of review material made of glass fiber cloth and resin. The fusion of the two materials during the processing and production process will cause some abnormalities. The production department must deal with various abnormalities in time. To ensure the excellent quality of… Continue Reading Various Exceptions And Solutions Of FR4
The FR4 epoxy sheet produced by the combination of glass fiber cloth and resin is in the shape of a flat plate. If you want to make various shapes, you need to process the FR4 board. There are four common processing methods for FR 4 epoxy sheet. Lathe and milling… Continue Reading Four common FR4 epoxy sheet processing methods
It is understood that Boeing recently is developing the 3D printing technology of continuous resin matrix composite, and manufacturing composite products through photo curing technology. Its basic principles include the movement of silk material through the conveyor mechanism to achieve a continuous 3D printing process, in which the silk material… Continue Reading How Boeing Co. manufactures composite products through photo curing technology?
FR-4 is the largest amount of CCL, The most widely used product,Its quality not only affects the CCL plant itself, but also seriously affect the processing rate of PCB processing and assembly of electronic products after the pass rate.Therefore, to understand more of the FR-4 CCL common defects and solutions… Continue Reading Common defects and solutions of FR-4 ( CCL )
The mounting form of the electronic components on the PCB has been developed from pin insertion using through-holes to high-density surface mount technology, and bare chip mounting is evolving from wire-to-die mounting. As from the QFP to BGA, CSP as the representative of the plastic package, PCB also requires more… Continue Reading Laminated sheet processing technology with glass cloth prepreg