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The flame retardant of the early halogen-free CCL is mainly achieved by the addition of flame-retardants. Common flame-retardants are phosphorus and nitrogen-containing additive flame-retardants such as phosphate ester, poly-phosphoric acid, melamine, aluminum hydroxide, magnesium hydroxide, and so on. Due to the large amount, glass transition temperature (Tg), heat resistance, processability… Continue Reading Knowledge about the Halogen-free Materials of Epoxy CCL

Electronic yarn is a kind of spun yarn. Its diameter is about 4-9μm. Electronic yarn has finer diameter and better performance, so that it can be used in the electronics and other high-end areas. while it have higher requirements for the technology and funds, the price is also higher. “Electronic… Continue Reading The Supply Chain Status of one Important Raw Materials in Copper Clad Laminate (CCL) —-Electronic Fiberglass Yarn and Cloth

Teflon high temperature cloth belt, Teflon high temperature mesh belt and Teflon tape are three extremely familiar words. In this bleak August, every order is really difficult. I always hold an inner gratitude for the customers who believe in me. At the same time, I am introspecting. I really do… Continue Reading The bleak August will be over, will there be rich in September?

1. Industrial production of epoxy resin in the world The first industrially valuable Bisphenol A epoxy resin of the world was manufactured in 1947 by Devoe-Raynolds of the United States. It opened up the technical history of chlorine-bisphenol A resin, and epoxy resin began industrial development; At the same time,… Continue Reading Review the industrial production process of epoxy resin/epoxy fiberglass board for 60 years

In the continuous development of information technology, electronic products, functions, types, structures are increasingly complex, to promote the PCB design gradually multi-level and high density, PCB design of the electromagnetic compatibility issues have also been valued and attention.Electromagnetic compatibility (EMC) design not only to ensure that all the PCB board… Continue Reading Analysis of Disturbance Factors in Design of Printed Circuit Board (PCB)

The mounting form of the electronic components on the PCB has been developed from pin insertion using through-holes to high-density surface mount technology, and bare chip mounting is evolving from wire-to-die mounting. As from the QFP to BGA, CSP as the representative of the plastic package, PCB also requires more… Continue Reading Laminated sheet processing technology with glass cloth prepreg